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Features
・Minimal thermal damage and burr formation
・No restrictions on focal distance
・Compatible with a wide variety of materialsbr>
・Enables high-precision micro-machining
Application Examples
・Medical device manufacturer: Precision machining of SUS materials
・Semiconductor material component manufacturers: Fine machining of silicon wafers, scribing, and shaping of high-hardness materials
・Automotive parts manufacturer: Micro-drilling of high-hardness materials