Pre-aligner / TAZMO
A unit that performs non-contact orientation-flat alignment and centering of semiconductor wafers at high speed.
Non-contact orientation flat alignment and centering equipment that is compatible with compound semiconductors and glass. Automatic recognition of wafer size and type of notch/orientation flat eliminates the need for settings from a host controller. The compact design with built-in controller is another feature of this system.
【Product features】
・MAF-R Series: Compound/glass compatible, back side adsorption type
High speed wafer centering and angle alignment without changing the wafer
The line sensor uses a CCD type photosensor element to achieve alignment of transparent glass and compound semiconductors.
(MAF-RAPN, MAF-RBPN, MAF-RC, MAF-RMZN, MAF-RP)
・MAF-S series: Compatible with compounds and glass - Edge hold type
Mechanical clamping type aligner with non-contact backside to minimize particle contamination of wafers
Compatible with compound semiconductors and glass (consultation required)
(MAF-SHKZ, MAF-SJ)
・MAF-R Series: Compound/glass compatible, back side adsorption type
High speed wafer centering and angle alignment without changing the wafer
The line sensor uses a CCD type photosensor element to achieve alignment of transparent glass and compound semiconductors.
(MAF-RAPN, MAF-RBPN, MAF-RC, MAF-RMZN, MAF-RP)
・MAF-S series: Compatible with compounds and glass - Edge hold type
Mechanical clamping type aligner with non-contact backside to minimize particle contamination of wafers
Compatible with compound semiconductors and glass (consultation required)
(MAF-SHKZ, MAF-SJ)
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